Patch panel chassis

ABSTRACT

A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations. A spring clip electrically links at least one module to the chassis.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is related to an application entitled MULTI-INTERFACEPATCH PANEL SYSTEM, having Ser. No. 10/714,538, filed on Nov. 13, 2003,an application entitled PATCH PANEL CHASSIS, having Ser. No. 10/714,502,filed on Nov. 13, 2003, and an application entitled MODULE WITHINTERCHANGEABLE CARD, having Ser. No. 10/714,583, filed on Nov. 13,2003; which applications are incorporated herein by reference.

TECHNICAL FIELD

This disclosure relates generally to devices and assemblies for patchpanel systems. More particularly, this disclosure relates to a patchpanel module with conductive spring clip.

BACKGROUND

Patch panels are used to provide an interconnection between networkelements. Patch panels typically include a number of interconnectingmodules positioned within a patch panel housing.

Conventional patch panel housings are manufactured from bent sheetmetal.That is, the process of manufacturing such housings includes bendingsheetmetal to form a top, a bottom and sides of the housing. The top,bottom and sides of the sheetmetal housing are typically held togetherby a number of fasteners. Additional fasteners are used to secure a backplane or panel to the sheet metal housing. The number of bent sheetmetalconstructions and fasteners involve significant time and labor in themanufacture and assembly of conventional patch panel housings.

Conventional interconnecting modules used with these patch panelhousings are generally configured as pass-through interconnections thatprovide patching interfaces to cables. These interconnecting modules mayinclude electrical components that require some type of conductivemechanical interface to achieve a grounding plane relative to the moduleor the chassis. Conventional methods of grounding a chassis relative tothe electrical components included the use of mechanical fasteners, suchas screws, securing a conductive sheetmetal faceplate to both theelectrical component and the chassis. Securing the conductive faceplateto the module and then to the chassis is both costly and time consuming.Also, a conductive faceplate costs more to produce than anon-conductive, plastic faceplate.

In general, improvement has been sought with respect to such system andarrangements, generally to better accommodate: manufacturing andassembling the system, grounding the system, and enabling adaptabilityof the system for a variety of applications.

SUMMARY

One aspect of the present disclosure relates to a patch panel systemincluding a chassis and a plurality of modules having grounding clips.The patch panel system may be used in combination with a chassis havingelongated structures that interconnects top, bottom, and side portionsof the chassis. The elongated structures are configured to receive aprinted circuit board that defines a back plane of the system, andreceive the plurality of modules within an interior of the chassis. Thegrounding clips on the modules provide a ground between the module andthe chassis.

In another aspect, the present disclosure relates to modules used with apatch panel system. The modules include a module card, at least onespring clip, and at least one electrical component. The card can beconfigured with a variety of connections that provide communication toconnections located on a back plane of the chassis.

In still another aspect, the present disclosure relates to a spring clipincluding two elongated members arranged and configured to extend over afirst surface and an opposite surface of a patch panel module and aflexible member extending away from the elongated members, wherein theflexible member is arranged and configured to mate with a patch panelchassis.

According to yet another aspect of the present invention, the presentdisclosure relates to a method of assembling a module for a patch-panelchassis. The method comprises providing a patch-panel chassis and amodule including a module card defining at least one hole and includinga first and second planar surface. The method further comprises mountinga first spring clip to a first edge of the module card, the spring clipincluding a first and second elongated member, each elongated memberdefining a hole, the first elongated member extending over the firstplanar surface of the module card and the second elongated memberextending over the second planar surface of the module card. The springclip further includes a flexible member such that the holes of theelongated members align on either side of the hole of the module card.The method further comprises providing a first electrical componentincluding at least one soldering tip, mounting the first electricalcomponent to the module card such that the soldering tip extends throughthe hole in the first elongated member, the hole in the module card, andthe hole in the second elongated member respectively, and soldering thesoldering tip of the first electrical component to the second flatsurface of the module card.

A variety of examples of desirable product features or methods are setforth in part in the description that follows, and in part will beapparent from the description, or may be learned by practicing variousaspects of the disclosure. The aspects of the disclosure may relate toindividual features as well as combinations of features. It is to beunderstood that both the foregoing general description and the followingdetailed description are explanatory only, and are not restrictive ofthe claimed invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a chassis, and shows multipleembodiments of modules, according to the principles of the presentdisclosure;

FIG. 2 is an exploded view of the chassis of FIG. 1;

FIG. 3 is perspective view of one embodiment of an elongated chassisstructure shown in FIG. 2;

FIG. 4 is an enlarged, elevational end view of the elongated chassisstructure of FIG. 3;

FIG. 5 is a cross-sectional view of the chassis of FIG. 1, shown withthe modules inserted within the chassis, taken along line 5-5;

FIG. 6 is a perspective view of a side plate shown in FIG. 2;

FIG. 7 is a perspective view of yet another embodiment of a modulehaving a module card and housing, and shows a first embodiment of asecuring arrangement, according to the principles of the presentdisclosure;

FIG. 8 is a perspective view of one of the multiple module embodimentsof FIG. 1, having a module card and housing, and shown with the modulecard and housing partially assembled;

FIG. 9 is a top plan view of the module of FIG. 8;

FIG. 10 is rear perspective view of the module of FIG. 8, shown with themodule card and housing fully assembled;

FIG. 11 is an exploded front perspective view of the module shown inFIG. 8;

FIG. 12 is an exploded rear perspective view of the module shown in FIG.8;

FIG. 13 is a perspective view of the module similar to FIG. 7, shownwith a second embodiment of a securing arrangement;

FIG. 14 is a perspective view of another of the multiple moduleembodiments of FIG. 1;

FIG. 15 is an exploded front perspective view of the module shown inFIG. 14;

FIG. 16 is an exploded rear perspective view of the module shown in FIG.14;

FIG. 17 is a perspective view of still another of the module embodimentsof FIG. 1;

FIG. 18 is a front perspective view of one embodiment of the printedcircuit board shown in FIG. 2;

FIG. 19 is a rear perspective view of the printed circuit board of FIG.18;

FIG. 20 is a front perspective view of the printed circuit board of FIG.18, shown with the multiple module embodiments of FIG. 1;

FIG. 21 is a perspective view of one embodiment of a blank shown in FIG.1;

FIG. 22 is a perspective view of another embodiment of a blank shown inFIG. 1;

FIG. 23 is a perspective view of the chassis of FIG. 1, shown with themultiple module embodiments inserted within the chassis;

FIG. 24 is a schematic representation of one configuration of amulti-interface patch panel system, according to the principles of thepresent disclosure;

FIG. 25 is a perspective view of a spring clip according to oneembodiment of the present invention;

FIG. 26 is a front view of the spring clip;

FIG. 27 is a side view of the spring clip;

FIG. 28 is an alternative embodiment of a module including a springclip.

FIG. 29 is an exploded view of the alternative embodiment of a modulewith spring clip shown in FIG. 28;

FIG. 30 is a cross-sectional view of the chassis of FIG. 1, shown with amodule 700 inserted within the chassis, taken along line 5-5; and

FIG. 31 is another cross-sectional view of the chassis of FIG. 1, shownwith the module 700 inserted within the chassis, taken along line 5-5.

DETAILED DESCRIPTION

Reference will now be made in detail to various features of the presentdisclosure that are illustrated in the accompanying drawings. Whereverpossible, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

The present disclosure relates to a patch panel system 100 (FIGS. 1 and23) that is a multi-interface system. The system 100 includes a chassis10 configured to receive a plurality of modules 18.

The plurality of modules may include a number of modules 18 and a module700, each having different electrical configurations. Each of thedifferent module configurations 18 includes some similar features, suchsimilar features being referenced with the same reference number in eachembodiment. For purposes of clarification, however, the modules arerepresented as modules 18(A)-18(D) to identify some of the variousmodule embodiments of the present disclosure. Module 700 is discussedwith reference to FIGS. 25-31.

I. Chassis

FIG. 1 illustrates a chassis 10 having features that are examples of howinventive aspects in accordance with the principles of the presentdisclosure may be practiced. The chassis 10 has a front 12 and a back14. The front 12 defines a front opening 16 configured for receipt ofthe plurality of modules 18. For clarity, only three modules 18(A)-18(C)are shown in FIG. 1. In the illustrated embodiment, the front opening 16is sized to receive seventeen modules. In particular, the chassis 10 hasan interior 20 defining seventeen compartments 22, each compartment 22configured to receive one module 18. In an alternative embodiment, thechassis may be configured with more or less than seventeen compartmentsto receive a corresponding number of modules.

The modules 18 are positionable in the compartments 22 of the interior20 of the chassis 10. The modules 18 are inserted within the interior 20of the chassis from the front opening 16 toward the back 14. Wheninserted, the modules 18 interconnect to a printed circuit board 24(FIG. 2) located at the back 14 of the chassis 10.

One feature of the chassis 10 relates to the mechanical method deployedin the construction and assembly of the chassis 10. Referring to FIG. 2,the chassis 10 generally includes a plurality of chassis structures 28(i.e. four chassis structures 28), a top plate 30, a bottom plate 32,and side plates 34, 36.

The chassis structures 28 are generally elongated members or bars 38that extend along the length of the chassis and define the corners orouter edges 40 (FIG. 5) of the chassis 10. The structures 28 function asrigid stabilizers or rigid corner elements that structurally define thechassis 10 and interconnect each of the top and bottom plates 30, 32 andthe side plates 34, 36. In one embodiment, the structures 28 areextruded aluminum bars, although other materials and methods ofmanufacture may be used to construct the structures 28 in accord withthe principles disclosed.

Referring now to FIGS. 3 and 4, the chassis structures 28 include aninterconnecting arrangement 26. The interconnecting arrangement 26 ismulti-functional in that the arrangement 26 secures the top and bottomplates 30, 32, printed circuit board 24, and modules 18 together as anassembled system. The interconnecting arrangement 26 includes aplurality of channels or slots, including at least a first slot 44 and asecond slot 46 extending between ends 48 of the chassis structure 28.The first slot 44 is located on a first side 50 of the structure 28, andthe second slot 48 is located on a second side 52. The second side 52 isgenerally perpendicular to the first side 50.

Referring now to FIG. 5, the top plate (i.e. first cover or top portion)30 is interconnected to and contained between first and second chassisstructures 28 a, 28 b. In particular, flanges 62 formed along forwardand rearward edges 64, 66 of the top plate 30 are positioned within thefirst slots 44 of the first and second chassis structures 28 a, 28 b.Likewise, the bottom plate (i.e. second cover or bottom portion) 32 isinterconnected to and contained between third and fourth chassisstructures 28 c, 28 d. That is, flanges 68 formed along forward andrearward edges 70, 72 of the bottom plate 32 are positioned within thefirst slots 44 of the third and fourth chassis structures 28 c, 28 d.

Referring back to FIG. 4, a hole 74 formed at each of the ends 48 of thechassis structure 28. In the illustrated embodiment, each of the chassisstructures 28 is an extrusion, and the hole 74 is formed along thelength of each extruded structure 28. In an alternative embodiment,holes may be formed only at the ends of the structure rather than extendalong the entire length of the structure.

As shown in FIG. 2, the side plates (i.e. end covers or end portions)34, 36 are connected to the ends 48 of chassis structures 28. Inparticular, fasteners 76 are inserted through holes 78 formed in theside plates 34, 36 and engage the hole 74 formed in the ends 48 of eachof the chassis structures 28. In the illustrated embodiment, thefasteners 76 are self-tapping fasteners that self-thread into theextruded hole 74. In other embodiments, threads may be machined orpre-formed at the ends 48 of the chassis structure 28 for use with othertypes of fasteners.

Referring to FIGS. 2 and 5, the second slot 46 of the chassis structure28 can be used to retain the printed circuit board 24. This designeliminates the need for fasteners to secure the printed circuit board tothe chassis 10. As shown in FIG. 5, the second slot 46 is sized andconfigured for receipt of top and bottom edges 80, 82 of the printedcircuit board 24. When assembled, the edges 80, 82 of the printedcircuit board 24 engage the second slots 46 of the second and fourthchassis structures 28 b, 28 c.

Still referring to FIG. 5, the second slots 46 of the chassis structurescan also be used to retain the modules 18 within the interior 20 of thechassis 10. That is, the second slot 46 is sized and configured for ofreceipt first and/or second flexible tabs 84, 86 of the modules 18. Whenassembled, the first and second flexible tabs 84, 86 of the modules 18engage the second slots 46 of the first and third chassis structures 28a, 28 d.

By this arrangement, each of the first and second slots 44, 46 of anyone of the four chassis structures 28 can be used for multiplefunctions. For example, the first slot 44 of one chassis structure 28may be oriented to either engage the forward or rearward edge 64, 66 ofthe top plate 30; or may be oriented to engage the forward or rearwardedge 70, 72 of the bottom plate 32. Accordingly, the one chassisstructure 28 may be oriented such that the second slot 46 engages one ofthe top or bottom edges 80, 82 of the printed circuit board 24; ororiented such that the second slot 46 engages one of the flexible tabs84, 86 of the module 18. In other words, a particular chassis structure28 can be used as either an upper chassis structure (e.g. 28 a, 28 b) ora lower chassis structure (e.g. 28 c, 28 d); and as either a forwardchassis structure (e.g. 28 a, 28 d) or a rearward chassis structure(e.g. 28 b, 28 c). By providing chassis structures each having identicalstructure features arranged to function in multiple ways, costsassociate with production of the structures and assembly of the chassisare reduced.

As can be further understood, the design of the chassis 10 and thechassis structures 28 eliminates the number of fasteners, and labor,required for assembly of the chassis 10. In this particular embodiment,eight fasteners 76 are used to define the interior 20 of the chassis 10(the interior 20 being defined by the top and bottom plates 30, 32, sideplates 34, 36, and the printed circuit board 24).

Referring back to FIG. 1, the side plates 34, 36 include mountingbrackets 88 that extend outward from the chassis 10. The mountingbrackets 88 include holes for receipt of fasteners (not shown) thatsecure the chassis to a frame or rack (not shown). The chassis 10 isconfigured to mount to standard 19-inch or 23-inch frames or racks,although may be constructed to mount to other sized racks used inindustry. Referring to FIG. 6, the side plates also include sideextensions 92. The extensions 92 are located at top and bottom edges 94,96 of the side plates. The extensions 92 project inward toward theopposite side plate of the chassis 10 when assembled. Referring to FIGS.2 and 6, the extensions 92 have edges 116 that assist in properlylocating the chassis structures 28. That is, the chassis structures 28of the chassis are positioned adjacent to the edges 116 of theextensions 92. When positioned in this manner, the hole 74 of thechassis structure 28 aligns with the corresponding hole 78 of the sideplate 36 for receipt of one of the fasteners 76.

Still referring to FIG. 6, each of the extensions 92 includes a lip 118that offsets the extension from the top and bottom plates 30, 32 of thechassis. The arrangement of the lips 118 provides recessed regions 134(only one shown, FIG. 1) adjacent to the top and bottom plates 30, 32.The recessed regions 134 may be used for placement of wire mesh or firescreens, for example.

Referring back to FIGS. 1 and 2, the illustrated chassis 10 includes acable organizer 98 located adjacent to the back 14 of the chassis. Thecable organizer 98 includes an angled or L-shaped portion 178 having aplurality of apertures 102 to which cable ties may be secured fororganizing and securing cables. The angled portion 178 is coupled to thechassis 10 by arms 104. The arms 104 fasten to the side plates 34, 36 ofthe chassis 10.

In the illustrated embodiment, the chassis 10 includes ventilationstructure 114 for ventilating the interior 20 of the chassis 10. In theillustrated embodiment, the ventilation structure 114 includes aplurality of elgongated apertures 106, 108 (FIG. 2) formed in each ofthe top and bottom plates 30, 32. The elongated apertures 106 of the topplate 30 are generally aligned with the elongated apertures 108 of thebottom plates 32 when the chassis 10 is assembled; and each of theelongated apertures 106, 108 is aligned with a compartment 22 of thechassis 10. The apertures 106, 108 provide ventilation to the modules 18when the module 18 is inserted within the compartments 22 of the chassis10.

As shown in FIG. 2, guides 110, 112 are located adjacent to the top andbottom plates 30, 32 of the chassis. Each pair of guides, i.e. one topand one bottom guide 110, 112, is associated with one of thecompartments 22 of the chassis 10. The pairs of guides 110, 112 arearranged to guide and receive one of the modules 18.

II. Module

Referring now to FIG. 7, one embodiment of the module 18 configured foruse with the chassis 10 is illustrated. The module 18 generally includesa housing 120 and a module card 122. As will be discussed in greaterdetail, the housing 120 and card 122 are configured to provide aninterface between an incoming element and an outgoing element. Theincoming and outgoing elements may include a variety of elementconfigurations, including cables, patch plugs or patch cords, or othercommunication configurations. Further, each of the elementconfigurations may include a variety of configuration types, such ascopper, and/or optical element configuration types. What is meant byincoming is that the element couples to the chassis 10 at the front 12,i.e. the element couples or interconnects to the module 18. What ismeant by outgoing is that the element couples to the chassis 10 at theback 14, i.e. that element couples to or terminates at the back plane150. “Incoming” and “outgoing” are not intended to imply a communicationflow of a signal. That is, incoming does not necessarily mean that theelement only provides an input and outgoing does not necessarily meanthat the element only receives an output.

In general, the module 18 includes at least one front face connector 144and an interface connector 146. The face connector 144 is configured toreceive an incoming element. The outgoing elements are typicallyterminated at back plane connectors 148 (FIG. 19) located on a backplane 150 of the chassis 10. The back plane 150 of the chassis 10 in theillustrated embodiment is defined by the printed circuit board 24. Theincoming and interface connectors 144, 146 are electronically connectedto the card 122 and provide electrical communication between theincoming elements and the outgoing elements terminated at the back planeconnectors 148 of the system 100.

Still referring to FIG. 7, one embodiment of the housing 120 of themodule 18 is illustrated. The housing 120 is generally L-shaped andincludes a face plate 124, a housing side or card retaining structure126, and a securing arrangement 128. The face place 124 is generallyoriented perpendicular to the card retaining structure 126. Whenassembled with the card 122, the face plate 124 is oriented generallyperpendicular to the card 122, and the card retaining structure 126 isoriented generally parallel to the card 122. In one embodiment, thehousing 120 is a molded construction. Other methods of manufacturing thehousing in accord with the principles disclosed are contemplated.

The face plate 124 includes an aperture or window arrangement 130. Inthe illustrated embodiment of FIG. 7, the window arrangement 130includes two windows 132 corresponding to a particular configuration ofthe card 122 (i.e. corresponding to the configuration and type ofincoming element and associate face connectors 144). In alternativeembodiments, the window arrangement 130 may include a different number,size, or orientation of windows formed in the face plate 124 for usewith other card configurations. For example, FIG. 14 illustrates awindow arrangement 130 having a single window 136 sized and configuredto correspond to another card configuration (e.g. a configurationrelated to incoming optical elements). FIG. 17 illustrates a windowarrangement 130 having three windows 138 configured to correspond to yetanother card configuration (e.g. a configuration related to an incomingEthernet element).

Referring now to FIGS. 8-10, the card retaining structure 126 of thehousing 120 includes latches 140 that interlock with holes 142 formed inthe card 122. Preferably, the card retaining structure 126 is designedsuch that the card 122 snap-fits to the housing 120; that is, thelatches 140 can be flexed to attach the card 122 to the housing 120. Inparticular, to assembly the module 18, the card 122 is positioned suchthat the face connectors 144 are located adjacent to the windowarrangement 130 of the housing 120 (FIGS. 8 and 9). The card 122 and thecard retaining structure 126 of the housing 120 are then pressedtogether so that the latches 140 engage the holes 142 formed in the card122 (FIG. 10). The card 122 can also be removed from the housing 120 byflexing the latches 140 toward one another and tilting and lifting card122 from the housing 120. This arrangement provides a module assemblythat requires no fasteners, thereby reducing assembly time and costsassociated with conventional arrangements. In an alternativearrangement, the latches or other latching members may be formed on thecard and holes formed in the housing to provide a similar snap-fitconnection.

Referring back to FIG. 8, openings 176 are formed between the face plate124 and the card retaining structure 126. The openings 176 may belocated adjacent opposite ends 208, 210 of the housing 120 (FIG. 14) ormay extend along the entire length of the housing between the oppositeends. The openings are provided for visual observance of LEDs (notshown) that may be operably placed on the card 122 of the module 18. Inuse, an operator can monitor operation of a particular module 18 byvisually inspecting an LED through the opening 176 of the module housing120.

Referring to FIGS. 8 and 11, icons or labels 212 can be placed on theface plate 124 of the housing 120. As shown in FIG. 23, the labels 212can be used for marking or identifying particular modules 18 or incomingelements.

Referring back to FIG. 1, the securing arrangements 128 of the modules18 are configured to removeably mount the modules within the chassis 10.In a first embodiment shown in FIG. 7, the securing arrangement 128 isdefined by the first flexible tab 84. The first tab 84 includes anextension portion 162 joined at an end 220 to the card retainingstructure 126. A projection 164 extends upward from the extensionportion 162 and is arranged to engage the second slot 46 of the chassisstructure 28 a (FIG. 5). The first tab 84 is configured to flex so thatthe tab 84 can be pressed downward to insert or remove the module 18from the chassis 10.

Still referring to FIG. 7, a handle portion 166 extends forward from thecard retaining structure 126. The handle portion 166 is used to maneuverthe card module. In the illustrated embodiment, the handle portion 166includes ribs 168. The ribs 168 provide a gripping surface to aid inremoving the module 18 from the chassis 10. When removing the module 18from the chassis 10, the first tab 84 is flexed downward and the moduleis pulled out of the chassis by the handle portion 166. In analternative embodiment, an aperture (not shown) may be formed in thehandle portion 166 so that an operator can place a finger(s) through theaperture and pull the module 18 from the chassis 10. Ribs 170 are alsoformed on the first tab 84 to assist in gripping the module 18.

Referring now to FIG. 13, a second embodiment of a securing arrangement128′ is illustrated. In this embodiment, the securing arrangement 128′is defined by the first flexible tab 84, and the second flexible tab 86.Similar to the first tab 84, the second flexible tab 86 also includes anextension portion 172 joined at an end 222 to the card retainingstructure 126. A projection 174 extends outward from the extensionportion 172. The projections 164, 174 of the first and second tabs 84,86 are arranged to engage the second slots 46 of the first and thirdchassis structures 28 a, 28 d (partially shown in FIG. 5). The tabs 84,86 are configured to flex so that the tab 84, 86 can be pressed towardone another to insert and remove the module 18 from the chassis 10. Inthe second securing arrangement embodiment 128′, a handle portion is notpresent. To remove the module 18 from the chassis 20, the tabs 84, 86are simply flexed toward one another to disengage the projections 164,174 from the second slots 46 of the chassis structures 28 a, 28 d, andthe module 18 is pulled out of the chassis 10 by the tabs 84, 86.

Referring back to FIGS. 1 and 23, the modules 18 are inserted with thecompartments 22 of the chassis 10 by sliding top and bottom edges 228,230 of the card 122 with the guides 110, 112. In applications where notall compartments 22 are utilized, blanks 200 may be inserted within thechassis 10. As shown in FIGS. 21 and 22, blanks 200 are essentiallyhousings 120 without a window arrangement formed in the face plate 124,and without LED openings 176. The blanks 200 include rails 224 locatedadjacent to the retaining structure 126 of the housing 120 (only a toprail is shown). The rails 224 simulate a card (122) and slide within theguides 110, 112 of the chassis 10 to assist in positioning the blank200.

FIG. 21 illustrates a first blank 200 having the first securingarrangement 128 embodiment with the handle portion 166, as previouslydescribed. FIG. 22 illustrates a second blank 200 having the secondsecuring arrangement embodiment 128′ with first and second tabs 84, 86,as previously described. When inserted within the compartments 22 of thechassis 10, the blanks 200 cover the front opening 16 so that theinterior 20 of the chassis 10 is enclosed. Enclosing the interior 20with the blanks 200 protects the modules 18 (i.e. the housings 120interconnected to cards 122) from dust and particulate contamination.

III. Multi-Interface System

The module 18 of the present disclosure is configured to be amulti-interface platform design that interfaces with a number ofincoming elements and outgoing elements. What is meant by incomingelements are elements or components, from other equipment, that coupleor connect to the module. As previously described, incoming elements caninclude, for example, patch cords having RJ-45 type connectors, Ethernetconnectors, or optical connectors. Likewise, what is meant by outgoingelements are elements or components, going to other equipment, thatcouple or connect to the back plane 150 of the chassis 10. As previouslydescribed, outgoing elements can include, for example, patch cordshaving RJ-45 type connectors, coax cables, or patch cords having opticalconnectors.

A number of the module embodiments having different face connectors areillustrated. For example, FIG. 7 shows a module 18(D) having faceconnectors 144 that are RJ-45 type connectors 154. FIG. 14 shows amodule 18(C) configured with incoming optical connectors 156, such asSC-type connectors. Alternatively, the face connectors 144 of the module18(B) in FIG. 17 include three RJ-45 face connectors 158 for use inapplications that require an Ethernet connection or a monitoringconnection.

In the same manner, the back plane 150 may incorporate multiple types ofback plane connectors 148. In the illustrated embodiment of FIG. 19, theback plane 150 has a variety of back plane connectors 148 including coaxconnectors 180, punch-down connectors 182 (i.e. insulation displacementconnectors), and RJ-45 connectors 184. In addition, the back planeconnector 148 may include a 110-connector or an optical connector 232(represented schematically in FIG. 24). The back plane 150 can beconfigured with a combination of the back plane connector types (e.g.180, 182, 184) or may configured with only a single back plane connectortype. In use, some or all of the back plane connectors 148 of the backplane 150 may be pre-wire with cables prior to inserting or placing anymodules 18 within the compartments 22 of the chassis 10 to ease assemblyand installation of an entire system.

The interface connector 146 (FIG. 5) of the system 100 provideselectrical communication between the card 122 and the printed circuitboard 24, and accordingly the face connectors 144 and the back planeconnectors 148. In the illustrated embodiment, the interface connector146 is a card edge connector having a first connector piece 186 (FIG. 8,for example) coupled to the card 122, and a second connector piece 188(FIG. 18). The second connector piece 188 of the interface connector 146is mounted to an interface plane 190 of the printed circuit board 24.Each of the second connector pieces 188 is associated with one of theback plane connectors 148 located on the back plane 150 of the chassis10.

As previously discussed, the modules 18 are designed to provide avariety of incoming and outgoing interconnection options. In addition,the module 18 can also be configured as either a passive module or anactive module. In a passive module configuration, power is not requiredbecause an incoming signal is either simply passed, without signalmodification, from the face connector to the back plane connector, orpassed between two face connectors in a loop-like configuration.

The module 18(A) illustrated in FIG. 8 can be configured as a passivemodule. In a passive configuration, two standard incoming RJ-45connectors 154 are used to interconnect to outgoing RJ-45 connectors 184(FIGS. 19 and 20). Only data information is transmitted. Other passivemodule configurations may include cards 122 having semi-conductors toprovide GR-1089 Intra-Office Lighting Protection, or make-before-breakconnections designed for high reliability. In yet another configuration,the face connectors 144 of the passive module may be interconnect withone another through tracings on the card 122. By interconnecting theface connectors 144, the passive module can operate in a normalpass-through mode or a patching mode.

In an active module configuration, power is required to modify, monitor,or otherwise interact with the incoming signal. Referring to FIG. 19,the back plane 150 defined by the printed circuit board 24 includes atleast one power input 192. The back plane 150 is illustrated with fourpower inputs, however most applications use only two power inputs. Fourpower inputs 192 are shown to illustrate the typical locations of thepower inputs 192. In particular, the printed circuit board 24 usuallyhas either: one pair of power inputs 192 arranged such that one powerinput is located at each of the opposite ends of the printed circuitboard 24; or one pair of power inputs 192 centrally located on theprinted circuit board 24. In the illustrated embodiment, the pair ofpower inputs 192 are 48 volt DC inputs. Power is transferred from thepower inputs 192 through the printed circuit board 24 and to theinterface connector 146.

The module 18 receives power from the power input 192 through theinterface connector 146. Preferably, the interface connector 146 isconfigured to accept any passive modules or active modules required byan application. As can be understood, in addition to transferring power,the interface connector 146 is also used to transmit control commandsand to transmit signals from the card 122 to the circuit board 24 (i.e.from the incoming element to the outgoing element). In alternativeembodiments, some or all of the power transfer, command transmittal, andsignal transmittal, may be accomplished through use of card edge pinsand card edge contacts.

The module 18(C) illustrated in FIG. 14 is an active module. In thisactive configuration, the card 122 is used to convert an incoming signalfrom the incoming optical connectors 156 to an outgoing coax signal (orcopper signal). In some applications, power may be injected along withthe data signal transmission to power a remote Ethernet application. Inthis particular arrangement, the module 18(C) includes a secondinterface connector 226 in addition to the first interface connector146. Referring to FIGS. 14-16, the second interface connector 226includes a first coax connector piece 202 interconnected to the card122. The first coax connector piece 202 couples to a second coaxconnector piece 204 of a bulkhead arrangement 196 (FIG. 19) to transmitthe converted coax signal. As shown in FIGS. 19 and 20, the bulkheadarrangement 196 includes the back plane connector 148 (i.e. includes theoutgoing coax connector 180), and the second coax connector piece 204.

In the illustrated embodiment shown in FIG. 14, the first coax connectorpiece 202 is a female connector piece. A tapered bushing or collar 206is positioned about the first coax connector piece 202 to assist inguiding and properly interconnecting the first and second coax connectorpieces 202, 204. In this particular application, the first interfaceconnector 146 is used only for control transmittal and power transfer.The signal transmittal is provided through the second coax interfaceconnection 226.

In other optical conversion configurations, the module 18(C) can beconfigured to interface between copper and optical elements for T3-E3signaling, high definition television signaling, or analog and digitalvideo signaling. Connectors corresponding to the copper elements mayinclude 75-ohm BNC connectors, for example. It is also contemplated thatIEEE 1394 type connectors can be used.

Referring back to FIG. 8, the module 18(A) may also be configured as anactive module for use in Ethernet applications. For example, in a singledensity power over Ethernet application, the two standard incoming RJ-45connectors 154 are not connected to the back plane 150, but with eachother in an arrangement to inject power along with the data to power aremote Ethernet appliance. Likewise, in a duel density power overEthernet application, the two standard incoming RJ-45 connectors 154 areconnected to the back plane 150, and with each other in an arrangementto inject power along with the data to power a remote Ethernetappliance. In these applications, data and power are transmitted fromthe system 100. Further, the module 18 can be configured to mode matchin single or dual port Ethernet applications. That is, the card can beconfigured to allow dissimilar Ethernet protocols (e.g. 100 Mb/secondand 1 Gb/second) to communicate with each other.

In the previous description, the modules described are generally signaltransmission modules. In some applications, a module configured as acentral processor and/or alarm card may be desired. Providing a centralprocessor and/or alarm module, for example, allows an operator to accessthe system locally or remotely for status or diagnostic functions. Themodule 18(B) illustrated in FIG. 17 is configured as a central processoror CPU module. The CPU module 18(B) includes three face connectors 144.In general, the first face connector 214 is typically configured as anEthernet connection. The second and third face connectors 216, 218 areconfigured respectively as a communication-in connection and acommunication-out connection. Referring to FIG. 18, the printed circuitboard 24 includes a processor interface connector 194 configured toprovide power to and transmit control signals to and from the CPU module18(B).

Referring now to FIG. 24, a general electrical schematic representationof one embodiment of the multi-interface patch panel system 100 isillustrated. As shown, the power input 192 is interconnected to each ofthe interface connectors 146. Likewise, the printed circuit boardprovides connections between the control processor interface connector194 and each of the interface connections 146. By this arrangement,modules 18 having either a passive configuration or an activeconfiguration may be operable positioned within any one of thecompartments 22 having an interface connector 146.

As herein disclosed, the multi-interface system of the presentdisclosure may include a variety of differently configured modules 18.The system is designed to provide significant flexibility for use in avariety of applications.

To illustrate, the back plane 150 of the chassis 10 may include one or acombination of back plane connector types 148 to accommodate aparticular system requirement. Likewise, the modules 18 of the system100 may include a number of face connector types 144. In addition, themodules 18 of the disclosed system 100 may be all passive, all active,or a combination of both. More significantly, a particular module may beoriginally passive and replaced with an active module at a later time.

For example, a first passive module 18 can be originally used andassociated with, for example, a first compartment 22 of the chassis.When the application changes and later requires a signal conversion ofan incoming element not initially accepted by the system, the firstpassive module can be removed and replaced with a second active moduleto convert the incoming element. The modules are arranged andconstructed such that second active module and first passive module areinterchangeable within the same compartment. In other words, the systempermits operators to mix and match active and passive modules within thesame chassis 10, and within the same compartments 22 of the chassis.

Yet another feature of the present disclosure relates to repair of themulti-interface system. Each of the cards 122 of the module 18 isconfigured with separate power supply components (not shown). In case ofa power surge, for example, only the individual damaged modules 18 needto be replaced. Accordingly, because no central power supply is needed,costs associated with supporting a redundant central power supply unitare eliminated. Also, power converters located on the cards 122 aredesigned to support the particular card only; thereby eliminating largeheat generating sources and providing for a high power densityassociated with the particular card 122.

The multi-interface system 100 of the present disclosure is a platformthat provides the advantages of modularizing the available interfaceoptions and provides different connection options using a variety ofconnector types, including both copper and optical. The interfaceoptions further include both active and passive and are designed to befield installable and replaceable.

IV. Spring Clip

Referring now to FIGS. 25-31, a spring clip 702 is provided forelectrically linking a module 700 to the chassis 10. FIGS. 25-27illustrate the spring clip according to one embodiment of the presentinvention. FIGS. 28 and 29 show the spring clip mounted on the module700. FIGS. 30 and 31 show the module mounted to the chassis and thespring clip biased against the chassis.

FIGS. 25-27 illustrate a spring clip according to another embodiment ofthe present invention. Referring to FIG. 25, the spring clip 702 isdefined by a first and second elongated member 901, 902 and a bridgingmember 905. Each elongated member 901, 902 defines a hole 903, 904respectively. A flexible tab 910 extends away from bridging member 905at a proximal end 913 of the bridging member 905. The bridging member905 widens at the proximal end 913, where it connects to flexible tab910.

Referring to FIG. 26, the bridging member 905 connects to a first end ofeach of the elongated members 901, 902 so that the elongated members901, 902 extend along parallel planes. Referring to FIG. 27, theelongated members 901, 902 widen at a second end. The holes 903, 904 ofelongated members 901, 902 are arranged and configured at this secondend such that they are in alignment with each other. Side tabs 914, 915extend along the bridging member 905 between the proximal end 913 andelongated members 902, 901 respectively. FIG. 27 further shows that theflexible tab 910 includes a convex section 911 and a tail 912. Theconvex section arcs from the proximal end 913 away from the elongatedmembers 901, 902. The tail 912 of flexible tab 910 begins to flatten outand then arc again, but terminates before it reaches the peak of theconvex section 911.

Referring now to FIG. 28, the spring clip is shown mounted on the module700. The module 700 generally includes a module card 701 with first andsecond opposing surfaces 711, 712, first and seconds ends 713, 714, anda first and second edge 715, 716. The module 700 further includes afirst spring clip 702. The first spring clip 702 is mounted on the firstend 713 of the module card 701 such that elongated member 902 extendsalong the second surface 712, elongated member 901 extends along thefirst surface 711 (FIG. 30), and bridging member 905 contacts the firstedge 715. Like module 18, module 700 is generally configured to providean interface between an incoming element and an outgoing element. Toaccomplish this, at least a first front connector 704 and an interfaceconnector 706 are coupled to the first and second ends 713, 714respectively of the module card 701.

Referring to FIG. 29, the first front connector 704 generally includes asolder pin 741, a plurality of connection pins 742, and a conductiveshield 743. The first end 713 of the module card 701 includes aplurality of holes 716 for receiving the connection pins 742. The modulecard 701 further includes a solder hole 720 for receiving the solder pin741. This solder hole 720 is arranged and configured so that it alignswith holes 903 and 904 of the spring clip 702 such that, when connectingthe front connector 704 to the module card 701, the solder pin 741extends through holes 904, 720, and 903 respectively. The module card701 may also include a second solder hole 721 spaced from the solderhole 720. In this case, the front connector 704 may also include asecond solder pin 744 (not shown) that will extend through the secondsolder hole 721 only.

The module card 701 may also include a second front connector 705 havinga solder pin 745, a plurality of connection pins 746, and a conductiveshield 747. In this case, a second spring clip 703 may also be mountedto the first end 713 of the module card 701 such that elongated member901 of the second spring clip 703 extends along the second surface 712of the module card 701 and the bridging member 905 of the second springclip 703 contacts the second edge 716 of the module card 701. The holes903, 904 of the second spring clip 703 will align with a solder hole 722of the card module 701 such that the solder pin 745 of the second frontconnector 705 will extend through holes 903, 722, 904 respectively whenthe second front connector 705 is connected to the module card 701. Aswith the first front connector 704, the second front connector 705 mayinclude a second solder pin 748 (not shown) that extends through asecond hole 723 in the module card 701 only.

As with module 18 in FIG. 7, the front connectors 704, 705 areconfigured to receive an incoming element. The outgoing elements aretypically terminated at back plane connectors 148 (FIG. 21) located on aback plane 150 of the chassis 10. The incoming and interface connectors704, 705, 706 are electronically connected to the card 701 and provideelectrical communication between the incoming elements and the outgoingelements terminated at the back plane connectors 148 of the system 100.Since the first and second spring clips 702, 703 are manufactured out ofconductive material, mounting the front connectors 704, 705 as describedabove electrically couples the spring clips 702, 703 to the conductiveshields 743, 747 of the first and second front connectors 704, 705. Inthis way, the spring clips 702, 703 are able to ground the frontconnectors 704, 705.

FIGS. 30 and 31 illustrate how the module 700 may connect to the chassisstructure discussed with respect to FIG. 5. As in FIG. 5, the top plate(i.e. first cover or top portion) 30 is interconnected to and containedbetween first and second chassis structures 28 a, 28 b. In particular,flanges 62 formed along forward and rearward edges 64, 66 of the topplate 30 are positioned within the first slots 44 of the first andsecond chassis structures 28 a, 28 b. Likewise, the bottom plate (i.e.second cover or bottom portion) 32 is interconnected to and containedbetween third and fourth chassis structures 28 c, 28 d. That is, flanges68 formed along forward and rearward edges 70, 72 of the bottom plate 32are positioned within the first slots 44 of the third and fourth chassisstructures 28 c, 28 d.

Referring to FIG. 30, the second slots 46 of the chassis structures canalso be used to retain one or more modules 700 within the interior 20 ofthe chassis 10. That is, the second slot 46 is sized and configured forreceipt of a first spring clip 702 of the module 700. In particular, theconvex section 911 of the flexible tab 910 of the spring clip 702 arcsinto the second slot 46 of the first chassis structure 28 a. The tail912 of the flexible tab 910 curves out of the second slot 46 so that thespring clip does not become trapped in the second slot 46. This allowsthe module 700 to be slid easily into and out of the chassis structure.A second spring clip 703 may also be mounted to the module 700. In thiscase, the flexible tab 910 of the second spring clip 703 can similarlymate with the second slot 46 of the fourth chassis structure 28 d.

This configuration allows the spring clips 702, 703 to provide a groundbetween the front connectors 704, 705 and the chassis 10. The springclips 702, 703 are in electrical communication with the conductiveshields 743, 747 of the front connectors 704, 705 and with the chassisstructures 28 a, 28 d. Furthermore, as shown in FIG. 31, the flexibletab 910 of the spring clip 702 need not mate with the second slot 46 ofthe chassis structure 28 a in order to provide this ground. The module700 may also be configured to slide into the chassis 10 such that theconvex sections 911 of the flexible tabs 910 of the spring clips 702,703 pass by slots 46 of chassis structures 28 a, 28 d and insteadcontact inner surfaces 728 a, 728 d of the chassis structures 28 a, 28d.

Because a ground between the front connectors 704, 705 and the chassis10 is provided using spring clips 702, 703, the module 700 may include anon-conductive face plate 750 like the face plates shown on modules18(A)-18(D). This face plate 750, depicted in dashed lines in FIG. 30,is oriented generally perpendicular to the module card 701 and includesapertures or window arrangements (like those shown in FIGS. 7-17) thatallow an incoming element to connect with front connectors 704, 705.

Since many embodiments of the present invention can be made withoutdeparting from the spirit and scope of the invention, certain aspects ofthe invention reside in the claims hereinafter appended.

1. A patch panel module, comprising: a module card including a frontconnector located at a first end of the module card and a rear connectorlocated at a second end of the module card opposite the front connector;at least one conductive spring clip including a first and secondelongated member coupled to a side edge on the first end of the modulecard, wherein the first elongated member extends along a first surfaceof the module card and the second elongate member extends along anopposite surface, the spring clip further including a third flexiblemember extending outwardly from the module; and at least one electricalcomponent coupled to the first end of the module card, wherein theelectrical component is in electrical communication with the springclip.
 2. The patch panel module of claim 1, further comprising a secondspring clip coupled to an opposite side edge on the first end of themodule card.
 3. The patch panel module of claim 2, further comprising asecond electrical component coupled to the first end of the module cardsuch that the second electrical component is in electrical communicationwith the second spring clip.
 4. The patch panel module of claim 1,wherein the electrical component comprises a shielded modular jack. 5.The patch panel module of claim 1, wherein the third flexible membersecures the module to a patch panel chassis.
 6. The patch panel moduleof claim 1, wherein the third flexible member includes a convex section.7. The patch panel module of claim 5, wherein the spring clip iselectrically coupled to the electrical component and provides agrounding plane between the electrical component and the chassis.
 8. Thepatch panel module of claim 1, further comprising a non-conductive faceplate mounted to the first end of the module card, the face plate havinga front opening.
 9. The patch panel module of claim 1, wherein themodule card further includes a circuit board, wherein the first andsecond elongated members of the spring clip extend parallel to the majorsurfaces of the circuit board.
 10. The patch panel module of claim 9,wherein the electrical component includes a projecting conductive pinand the circuit board includes a hole configured such that theprojecting conductive pin can extend through the hole; wherein at leastone of the elongated members of the spring clip includes a hole and isaligned such that the projecting conductive pin of the electricalcomponent extends through the hole in the elongated member as well asthe hole in the circuit board.
 11. A patch panel interface system,comprising: a chassis having a plurality of module compartments and aback plane, the back plane including at least a plurality of first backplane connectors; a module including a first front connector, the moduleinterconnected to one of the plurality of first back plane connectors;and a flexible grounding clip coupled to the module, wherein theflexible grounding clip is in electrical communication with the chassis.12. The patch panel interface system of claim 11, wherein the chassisfurther comprises a plurality of securing slots wherein the flexiblegrounding clip mates with one of the securing slots, thereby securingthe module to the chassis.
 13. The patch panel interface system of claim11, wherein the flexible grounding clip is in electrical communicationwith the first front connector; wherein the flexible grounding clipprovides a grounding plane between the first front connector and thechassis.
 14. The patch panel interface system of claim 13, wherein themodule further comprises a second grounding clip positioned opposite thefirst flexible grounding clip, the second flexible grounding cliparranged and configured to mate with a second securing slot of thechassis.
 15. The patch panel interface system of claim 14, wherein themodule further comprises a second front connector electrically coupledto the second flexible grounding clip such that the second flexiblegrounding clip provides a ground between the second front connector andthe chassis.
 16. A spring clip for securing a module to a chassiscomprising: a first elongated member configured to extend over a firstplanar surface of a module, the first elongate member defining a firsthole; a second elongated member configured to extend over a secondplanar surface of the module, the second elongated member defining asecond hole, the second surface parallel to the first surface; and aflexible member convexly extending away from the elongated members. 17.The spring clip of claim 16, wherein the spring clip is electricallyconductive.
 18. The spring clip of claim 17, wherein the spring clipprovides a positive ground for the chassis.
 19. The spring clip of claim17, wherein the module includes an electrical component and the springclip provides a ground for the electrical component.
 20. The spring clipof claim 16, wherein the two elongated sections are arranged in aU-shaped configuration.
 21. The spring clip of claim 16, wherein thespring clip is mounted on the module prior to securing other componentsto the module.
 22. A method of assembling a module for a patch panelchassis, the method comprising: providing a module including a modulecard defining at least one hole, the module card including a first andsecond planar surface; providing a first electrical component includingat least one soldering tip; mounting a first spring clip to a first edgeof the module card, the spring clip including a first and secondelongated member, each elongated member defining a hole, the firstelongated member extending over the first planar surface of the modulecard and the second elongated member extending over the second planarsurface of the module card, the spring clip further including a flexiblemember such that the holes of the elongated members align on either sideof the hole of the module card; mounting the first electrical componentto the module card such that the soldering tip extends through the holein the first elongated member, the hole in the module card, and the holein the second elongated member respectively; and soldering the solderingtip of the first electrical component to the second planar surface ofthe module card.
 23. The method of claim 22, further comprising mountinga second spring clip to a second edge of the module card, wherein eachelongated member of the second spring clip aligns with a second hole inthe module card; and mounting a second electrical component including atleast one soldering tip to the module card such that the soldering tipis received in the holes of one of the elongated members, the modulecard, and the other elongated member respectively.
 24. The method ofclaim 22, wherein the first spring clip provides a ground to theelectrical component.